What technical documents are available?

Documents backing the heat resistance, vapor pressure, and vacuum stability of MFF-M PFPE ferrofluid are published as PDFs. Vapor pressure was measured at KOPTRI (Korea Polymer Testing & Research Institute) by the OECD TG 104 effusion method, and heat resistance at KITECH (Korea Institute of Industrial Technology) by TGA. Overview decks, brochures, vapor-pressure notes, test results, and raw TGA data for active and inert gases are all available.

How is vapor pressure measured?

Materials with very low vapor pressure cannot be measured directly with a pressure gauge. Weight loss is observed under isothermal conditions in a vacuum TGA to obtain an evaporation rate, which is then regressed to give the vapor pressure at room temperature. The OECD TG 104 effusion method defines this procedure.

How is heat resistance verified?

TGA measures weight loss against temperature at a 10℃/min ramp, and DTA shows endothermic and exothermic behaviour alongside it. The temperature at which 1 wt% is lost is used as the reference for the usable range. The actual operating temperature depends on rotational speed, shaft diameter, and running time.

Why does vapor pressure data matter?

Semiconductor processes typically run below 10⁻⁶ Pa. If a material inside the chamber outgasses, it caps the attainable vacuum and leads to particle growth, pattern contamination, and film non-uniformity — all of which hit yield directly. That is why a quantitative acceptance figure is needed, not a qualitative claim of "low vapor pressure".

Can the documents be downloaded directly?

Everything on this page can be viewed and downloaded without registration. For a review against specific process conditions, or for additional data, please contact us.